精密倒裝芯片貼片機 CB-610
芯片倒裝鍵合機
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功能：貼片應用：倒裝焊
特點： Correspond to fine pitch of electrodes with mounting accuracy ± 1μm Correspond yo ultra-low load（0.049N）to high load (490N）without head replacement follows thermal variation of work and tools in real time Equipped with recipes for various bonding processes as standard Feedback of abnormalities by bonding log analysis
Standard Items & Optional Items ＜Standard Items＞ Flip chip unit Constant heat stage ATC（ Automatic ceramic tool change ) Calibration Process management (logger / export to another PC) Automatic leveling mechanism
＜Optional Items＞ Eutectic head ( No heating ) Eutectic purge jig Eutectic stage(□52mm pulse heater Transfer function( Flux, Paste) Dispenser unit( except dispenser) Die bonding Chip imaging camera Gel pack Ultrasonic bonding ID Reading
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項目 | 規格參數 |
芯片尺寸 | 1?20 毫米 |
基板尺寸（WXL） | 5~100mm X 235mm |
貼片平臺 | 恒溫加熱臺RT~ ~ 250℃ |
芯片貼裝精度 | ≤±1微米 |
低載荷壓力范圍 | 0.049～4.9N (5~500g) |
高載荷壓力范圍 | 4.9～490N (0.5～50kg) |
設備尺寸 ：1320（W）X 1800（D）X1780（H）mm
精密倒裝芯片貼片機 CB-610
